TF Securities analyst Ming-Chi Kuo believes Apple will change to a extra sophisticated SiP (System-in-Bundle) resolution for the third-generation AirPods which he had beforehand claimed will launch early subsequent 12 months. Apple at present makes use of floor mount know-how (SMT) for the second-gen. AirPods. The transfer to a SiP resolution will enable Apple to …
The post Kuo: AirPods 3 Could Feature Complex Packaging Solution Like AirPods Pro appeared first on iTechBlog.
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